Vacuum Lamination as a Foundation for Bubble-Free Processing
Vacuum lamination has a direct and measurable impact on downstream photolithography and etch processes, where surface uniformity is critical. In advanced semiconductor and microfabrication environments, even microscopic air bubbles trapped during lamination can cause pattern distortion, resist lift, or uneven etch depths. By applying films under controlled vacuum conditions, vacuum lamination eliminates these defects before they propagate through subsequent process steps. Bubble-free bonding ensures that photoresists and protective films maintain intimate contact with the substrate, supporting higher resolution pattern transfer. As feature sizes continue to shrink, vacuum lamination is increasingly viewed as a foundational process that safeguards process stability rather than a simple preparatory step. How Bubble-Free Lamination Protects Critical Patterning Steps ...
